2026-2030
(#: 1st author, *: corresponding author)
2026
5. Chaerin Park, Pengzhan Liu, Hyeonjeong Lee, Hyunho Kim, Yechan Kim, Taesung Kim*.Enhancing the stabilization of ceria particles using a novel non-ionic dispersant via physical adsorption.Colloids and Surfaces A: Physicochemical and Engineering Aspects, 30 January (2026).
4. Jongyeong Jeon#, Chaerin Park#, Seunghwan Lee, Gunhyoung Kim, Yechan Kim, Hyeonjeong Lee, Seokchan Lee, Hyunkyu Kim, Juyeol Lee, Taesung Kim*. Selective control on material removal rate in chemical mechanical polishing of Cu/borosilicate glass using through-glass via technology. Applied Surface Science, 14 February (2026).
3. Hosin Hwang#, Jinhyoung Lee#, Ziyang Wang, Hyunho Kim, Taesung Kim*.Single-step SiCN dangling bond activation for 3D heterogeneous integration. Applied Surface Science, 11 February (2026).
2. Jinhyoung Lee#, Hyeonjeong Lee#, Donghwan Choi#, Gunhyoung Kim#, Hyunkyu Kim, Jongyeong Jeon, Junmin Ahn, Yechan Kim, Geumji Back, Geonwook Kim, Hyunho Kim, Hyunwoo Shim, Junil Cho, Dongho Lee, Seowoo Son, Joohwan Ha, Seokchan Lee, Dayoung Yu, Yein Jo, Hyoeng-U Kim, Won-Jun Jang , Taesung Kim*. Artificial Modulation of the CeO2 Nanoparticle Tunneling Junction Array. Nano letters, 3 February (2026). (IF : 9.1, JCR<10%)
1. Geonwook Kim#, Hyunho Seok#, Sihoon Son#, Hyunbin Choi#, Hyunho Kim, Jinhyoung Lee, Gunhyoung Kim, Dongho Lee, Seowoo Son, Taesung Kim*. Thermal Expansion-Engineered Ferroelectric Transistor Arrays for Scalable Edge AI Computing. ACS Nano, 21 January (2026). (IF: 16.1, JCR＜5%)
